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 Chartland Electronics

 

CHIPBEADS

Our chip bead inductors are of monolithic construction for highly reliable performance. With both low DC resistance and high Q value in the high frequency range, these chips are suited to a variety of telecommunication and digital device applications. The compact design enhances its circuit board utilization.

 

MULTI-LAYER CHIP BEADS
Small and magnetically shielded for high density, space saving applications, these chips have an excellent high frequency performance. Ideal for EMI suppressions and noise filtering of telecommunication and high frequency devices.
LBC Series
Specifications LBR Series Specifications
LBL Series Specifications LBD Series Specifications
LBH Series Specifications LBM Series Specifications
WOUND CHIP BEADS
Built with a wire wound structure to attain higher current capacity up to 6000mA, with low DC resistance. Available in three miniature sizes.
WBC Series Specifications
MULTI-LAYER CHIP INDUCTORS
High reliability with magnetic shielding to eliminate cross talk. Of specialised construction to provide outstanding solderability in flow and re-flow soldering situations.
LIC Series Specifications
MULTI-LAYER CHIP INDUCTORS FOR HIGH FREQUENCY

Designed for high frequency applications up to 6GHz, available with a wide range of inductances.

LIF Series Specifications
WOUND CHIP INDUCTORS FOR SIGNAL CIRCUIT

Ideal for use in communication tools such as PCs, VCRs, HDDs, CD-Rs and Modems. Available in a wide range of inductances of low DC resistance at high Q value.

WIS Series Specifications
COIL FOR HIGH FREQUENCY

Designed with a coil body of ceramic material structure, for high frequency applications up to 2GHz. High Q value of inductances ranging from 3.3nH to 390nH at 100MHz.

CIF Series Specifications
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